Advanced Packaging & Power Delivery Senior Engineer
About Us
Axelera AI https://www.axelera.ai is not your regular deep-tech startup. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us.
In just four years, we have raised a total of $370 million and have built a world-class team of 220+ employees (including 49+ PhDs with more than 40,000 citations), both remotely from 18 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands.
We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million.
Our unwavering commitment to innovation has firmly established us as a global industry pioneer.
Are you up for the challenge?
Position Overview
As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of our next-generation AI accelerators. You will own power-delivery design across the full stack - from on-die power grids to package and PCB PDN - and bring deep expertise in advanced packaging technologies to help us scale from today's products to tomorrow's multi-chiplet, 3D-integrated systems.
Working within our R&D Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery - with real ownership and direct impact on the chips we ship.
Key responsibilities:
- Own power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysis.
- Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design.
- Perform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integ...