Principal Wafer Bonding Integration Engineer

About us
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
Role Overview
We are seeking a Wafer Bonding Integration Engineer to lead the development, integration, and manufacturing transfer of advanced wafer bonding processes that are foundational to nEye's next-generation optical switching products.
This is a highly cross-functional role sitting at the intersection of product engineering, process integration, and manufacturing. You will partner closely with internal design teams and external foundry partners to develop robust wafer bonding solutions, drive new product introduction (NPI), and enable successful transition into volume manufacturing.
The ideal candidate combines deep technical expertise in wafer bonding with strong product integration experience and enjoys working directly with foundries to solve complex manufacturing challenges.
Candidates with foundry process integration, advanced packaging, MEMS, silicon photonics, or Technical Service Engineering experience are encouraged to apply.