Quantum Process Integration Lead (FEOL)
ABOUT US
QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!
As a Quantum Process Integration Lead (Front end of line), you’ll play a crucial role in developing our state of the art quantum processors and advanced multi-layer chip stack architecture. These components development aims to achieve best in class quantum chips which are in turn integrated in our VIO technology. You will define fabrication development projects, device specifications, design of experiments, and ensure seamless integration and optimisation of all technical components. Your work will be essential as we scale to increasingly complex systems and deliver on the promise of quantum computing.
What you'll be doing
- Plan and lead the development of front-end fabrication technologies, with a focus on enhancing the performance, reliability, and manufacturability of Josephson junctions, metallization, through-silicon vias, and other device components integrated into quantum processors.
- Develop and coordinate integration test plans in collaboration with cross-functional teams.
- Lead the definition and formalisation of chip development processes across the organisation.
- Establish scalable, well-documented integration procedures to support system growth.
- Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.
Your Profile
- 4+ years of experience in chip development of deep-tech or low-volume technology, pr...