Senior 3D Packaging & Tooling Engineer
ABOUT US
QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!
As a 3D Packaging & Tooling Engineer, you won't just be running a recipe, you will be the lead architect for how our VIO products are physically realized. You will take high-precision assembly machines and push them beyond their factory specs to handle novel 3D architectures and the precise tolerances required for optimal device performance.
What you'll be doing
- Tooling Adaptation: Lead the modification and customization of high-precision assembly equipment (e.g., flip-chip bonders, die attaches) to meet unique quantum 3D integration requirements.
- Advanced Process Development: Develop sub-micron placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates. Lead the evaluation of glues, adhesives, and solder materials. You will determine which materials can meet our alignment requirements while surviving the extreme thermal cycling and vacuum conditions of a dilution refrigerator.
- Non-Standard 3D Assembly: Design and execute "out-of-the-box" integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.
- Vendor Management: Interface directly with equipment manufacturers to drive co-development of specialized hardware.
Your Profile
- Education: BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science.
- Deep Tooling Fluency: 7+ years of han...